HP ProLiant DL80 Gen9

HPE's cost-optimized 2U two-socket rack server for Intel Xeon E5-2600 v3/v4, aimed at service providers and SMBs running basic IT infrastructure and capacity-intensive workloads like backup and cold storage.

Memory

Slots: 8 DIMM (4 per processor, 4 channels per processor, 1 DIMM per channel)
Type: HPE DDR4 SmartMemory or Standard Memory RDIMM/LRDIMM
Max: 256 GB — 8 × 32 GB LRDIMM @ 2400 MHz
Speed: v4 CPUs: up to 2400 MT/s; v3 CPUs: up to 2133 MT/s (lower with 4-, 6- and some 8-core parts — see CPU notes)
Protection: Advanced ECC, Online Spare, memory mirroring
Notes: UDIMM, RDIMM and LRDIMM cannot be mixed; v3 and v4 memory kits are not interchangeable between generations

Storage

Chassis options: 4 LFF non-hot-plug · 8 LFF hot-plug · 12 LFF hot-plug
Embedded RAID (Entry models): HPE Dynamic Smart Array B140i: SATA only, up to 10 drives, 6 Gb/s, RAID 0/1/5, UEFI mode only
Embedded HBA (Base models): HPE H240 Smart Host Bus Adapter (FIO): up to 8 SAS/SATA drives, 12 Gb/s, RAID 0/1/5
Optional Smart Array controllers: P440/2GB, P440/4GB (820834-B21, 726821-B21), P840/4GB (726897-B21), P441/4GB external (726825-B21), P841/4GB external (726903-B21)
Optional HBA: H240 12Gb 2-port internal (726907-B21), H241 12Gb 2-port external (726911-B21)
Max internal (hot-plug LFF SAS/SATA): 96 TB — 12 × 8 TB (12 LFF cage)
Max internal (hot-plug LFF SATA SSD): 46.08 TB — 12 × 3.84 TB (12 LFF cage)
Max internal (non-hot-plug LFF SATA): 32 TB — 8 × 4 TB (8 LFF cage)
Optical: External only, via HPE Mobile USB Non-Leaded DVD-RW Drive (701498-B21); no internal optical bay
microSD: 1 internal slot, not hot-pluggable

Graphics

Integrated: Matrox G200eH2; 1280×1024 (32 bpp), 1920×1200 (16 bpp)
GPU support: 1 × full-height full-length card via the GPU Enablement Kit (765518-B21, adds 1 FHFL slot, a fan and power cable); mutually exclusive with the FHHL and FlexibleLOM risers

Expansion

Slot 1 (standard): PCIe 3.0 x16, low profile, CPU 1
Slot 1 (GPU riser, optional): PCIe 3.0 x16, full-height full-length
Slot 1 (FHHL riser, optional): PCIe 3.0 x8/x4/x1, full-height half-length
Slot 2 (FHHL riser, optional): PCIe 3.0 x8, full-height half-length, CPU 1 — requires CPU 2 to be populated
Slot 3 (standard): PCIe 3.0 x8, low profile, CPU 1
Slot 4 (standard): PCIe 3.0 x16, low profile, CPU 1
Slot 4 (Primary Riser, optional): PCIe 3.0 x8, low profile — replaces the standard slot 4
Slot 5 (FlexibleLOM riser, optional): PCIe 3.0 x8, FlexibleLOM — mandatory for installing a FlexibleLOM
Slot 6 (standard): PCIe 3.0 x8, low profile, CPU 2
Slot 7 (standard): PCIe 3.0 x16, low profile, CPU 2
Notes: Only one of the FHHL, FlexibleLOM or GPU risers can be installed at a time; CPU2-only slots (6, 7, 2) need a second processor

Networking

Embedded: HPE Embedded Dual Port 361i Adapter (2 × 1GbE)
FlexibleLOM (optional, needs riser 765514-B21): 1GbE 366FLR (665240-B21); 10GbE 533FLR-T, 534FLR-SFP+, 536FLR-T, 546FLR-SFP+, 560FLR-SFP+, 561FLR-T, 562FLR-SFP+
PCIe adapters: 1GbE 331T/332T/361T/366T; 10GbE 530T/530SFP/546SFP+/560SFP+/561T/562SFP+; 25GbE 620QSFP28 (1-port); InfiniBand FDR/40GbE 544+QSFP (764284-B21)

Power

Entry-level supply: HPE 550 W Standard FIO Power Supply (730941-B21), 80 PLUS Silver (~89%), C14 inlet, non-redundant, factory-install only
Redundant supply: HPE 900 W AC/240 VDC Redundant Power Supply Kit (820792-B21): 2 power input modules + backplane, 80 PLUS Gold (~92%), C14 inlet, both 100-240 VAC and 240 VDC
Standalone 900 W modules: 900 W AC/240VDC Power Input Module (775595-B21/828734-B21) + RPS Power Backplane (814835-B21/828735-B21), each backplane supports up to 2 input modules
Input (550 W PSU): 100-240 VAC, 47-63 Hz; 6.7 A @ 100 VAC / 3.3 A @ 200 VAC; rated power <670 W @ 100 VAC; 2201 BTU/hr max
Notes: Mixing power supplies of different voltage, output or efficiency rating is not supported

Ports

USB: Up to 4 total: 1 front USB 2.0 (standard, quick-release-ear upgrade optional), 2 rear USB 3.0, 1 internal USB 3.0
Video: 1 × VGA, rear; Vaux support
Storage battery connector: Optional HPE Smart Storage Battery connector (for Smart Array controllers)

Physical

Form factor: 2U rack
Dimensions (with bezel): 8.75 × 44.55 × 60.7 cm (3.45 × 17.54 × 23.9 in) — 8LFF and 12LFF versions share this envelope
Weight: 16.59 kg (36.58 lb) min – 21.59 kg (47.6 lb) max
Operating temperature: 10–35 °C standard; extended ASHRAE A3 support to 5–10 °C / 35–40 °C for approved configurations; derated 1 °C per 305 m above sea level to 3050 m
Non-operating temperature: -30 to 60 °C
Relative humidity: 8–90% operating (non-condensing); 5–95% non-operating
Altitude: 3048 m operating; 9144 m non-operating
Acoustic noise (idle): LWAd 4.7–4.8 B, LpAm 33–34 dBA
Acoustic noise (operating): LWAd 4.9 B, LpAm 34–36 dBA

Management

BMC: HPE iLO 4 (firmware 2.0 or later), 2 GB NAND
Tools: Intelligent Provisioning (standard), RESTful API for iLO 4 (Redfish 1.0), Smart Update Manager / SPP, HPE Insight Control and OneView (optional)
Licenses (optional): iLO Essentials, iLO Scale-Out, iLO Advanced
Security: Power-on and administrator passwords, serial interface control, UEFI Secure Boot, optional TPM 1.2 (488069-B21) or TPM 2.0 (745823-B21, UEFI mode only)
Warranty: 3-year parts/labor/onsite hardware diagnostic support (server); pre-configured models ship with 1-Year Parts, 1-Year Labor, 1-Year Onsite NBD

Operating systems

Supported (QuickSpecs): Microsoft Windows Server, Red Hat Enterprise Linux (RHEL), SUSE Linux Enterprise Server (SLES), VMware, ClearOS

Processors

Intel Xeon E5-2660 v4
Intel Xeon E5-2650 v4
Intel Xeon E5-2650L v4
Intel Xeon E5-2640 v4
Intel Xeon E5-2630 v4
Intel Xeon E5-2630L v4
Intel Xeon E5-2623 v4
Intel Xeon E5-2620 v4
Intel Xeon E5-2609 v4
Intel Xeon E5-2603 v4
Intel Xeon E5-2660 v3
Intel Xeon E5-2650 v3
Intel Xeon E5-2650L v3
Intel Xeon E5-2640 v3
Intel Xeon E5-2630 v3
Intel Xeon E5-2630L v3
Intel Xeon E5-2623 v3
Intel Xeon E5-2620 v3
Intel Xeon E5-2609 v3
Intel Xeon E5-2603 v3