Dell PowerEdge T430
Dell's 13th-generation two-socket tower server (Xeon E5-2600 v3/v4, 12 DDR4 RDIMM slots, 6 full-height PCIe slots) with 4 cabled 3.5", 8 hot-plug 3.5" or 16 hot-plug 2.5" drives in a short 22-inch-deep, office-quiet chassis that can be converted to a 5U rack server. Aimed at small offices and remote/branch offices running file, print, mail, collaboration and web workloads.
Memory
- Slots
- 12 DDR4 DIMM sockets: 8 for CPU1 (A1-A8, 4 channels × 2) and 4 for CPU2 (B1-B4, 4 channels × 1)
- DIMMs
- RDIMM only: 4 GB single rank; 8, 16 and 32 GB single or dual rank (configurator: 4/8/16/32 GB RDIMM at 2400 MT/s)
- Speed
- 2400, 2133 or 1866 MT/s, set by the system profile and the CPU's maximum memory speed
- Max
- 384 GB with two CPUs; 256 GB with one CPU
- Min
- 4 GB with one CPU; 8 GB with two (at least one DIMM per CPU)
- Rules
- No RDIMM/LRDIMM mixing; populate white-tab sockets first, then black; largest DIMMs first; with two CPUs keep the CPU1 and CPU2 layouts identical
- RAS
- Advanced ECC, memory-optimized (independent channel) mode, memory sparing (one rank per channel), memory mirroring, SDDC
Storage
- Chassis options
- Up to 4 × 3.5" cabled SATA/nearline SAS drives; up to 8 × 3.5" hot-plug; or up to 16 × 2.5" hot-plug
- Backplanes
- x8 SAS/SATA backplane for 3.5" drives (also takes up to 8 × 2.5" SAS/SATA SSD drives in 3.5" carriers via adapters); x16 SAS/SATA backplane for 2.5" drives; cabled chassis has no backplane
- Drive types
- SAS, SATA, nearline SAS, SSD
- RAID
- Up to 1 internal and 1 external controller: PERC H730, PERC H730P (internal), PERC H830 (external)
- Optical
- One optional SATA DVD-ROM or DVD+/-RW drive (full-height or slim)
- Tape
- Up to two optional 5.25" tape drives; only one 5.25" removable-media device when a double-width GPU is fitted
- Boot / embedded
- Optional Internal Dual SD Module (IDSDM, two SD slots, one for redundancy); internal USB 3.0 port
Graphics
- Integrated
- Matrox G200 in iDRAC8, 16 MB; up to 1440 × 900 at 60 Hz
- GPU options
- One double-width GPU in slot 4, or two single-width GPUs in slots 3 and 4 (one or two CPUs); all GPUs the same model; 300 W or less each
- GPU requirements
- Redundant 1100 W AC power supplies; double-width GPU in slot 3 blocks slot 2, in slot 4 blocks slot 3; GPUs not supported in expanded-temperature operation
Expansion
- Slot 1
- PCIe 2.0 x4 (x8 connector), full height, half length, from the PCH
- Slot 2
- PCIe 2.0 x1 (x1 connector), full height, half length, from the PCH
- Slot 3
- PCIe 3.0 x16, full height, full length, CPU1
- Slot 4
- PCIe 3.0 x16, full height, full length, CPU1
- Slot 5
- PCIe 3.0 x8, full height, half length, CPU2 (needs both CPUs)
- Slot 6
- PCIe 3.0 x8, full height, half length, CPU2 (needs both CPUs)
- Card priority
- Double-width GPU slot 4 (max 1); single-width GPU slots 3, 4 (max 2); RAID slots 3, 4; H830 slots 3-6; NICs slots 3, 4, 5, 6, 1
Networking
- Embedded
- 2 × 1 GbE (Broadcom 5720 LOM), 10/100/1000 Mb/s
- Add-in
- Optional add-in NICs and HBAs (10 GbE, FC8, 1 GbE) in the PCIe slots
Power
- Cabled (non-redundant)
- 450 W AC Bronze, 100-240 V; only with the cabled-drive or x8-backplane chassis
- Hot-plug (1+1 redundant)
- 495 W AC Platinum, 750 W AC Platinum, 1100 W AC Platinum; 100-240 V autoranging
- Heat dissipation (max)
- 450 W: 1871 BTU/hr; 495 W: 1908 BTU/hr; 750 W: 2891 BTU/hr; 1100 W: 4100 BTU/hr
- Cooling
- One internal cooling fan plus an optional external cooling fan at the rear
Ports
- Front
- iDRAC Direct micro-USB 2.0 port, USB 3.0 port (cabled chassis: one USB 2.0 + one USB 3.0); VGA only in rack mode
- Rear
- 6 × USB (5 × USB 2.0, 1 × USB 3.0), VGA, DB-9 serial, 2 × RJ-45 1 GbE, optional iDRAC port, system ID connector
- Internal
- 1 × USB 3.0
Physical
- Form factor
- Tower, convertible to 5U rack (all configurations except the 4 × 3.5" cabled chassis)
- Tower size
- H 430.3 mm (443.3 mm with feet, 471.3 mm with wheels) × W 218 mm (304.5 mm with feet) × D 542.2 mm to rear wall (558.6 mm with bezel; 578.42/594.82 mm to PSU handle)
- Rack size
- H 218 mm (5U) × W 430.3 mm (482.4 mm with ears) × D 538.4-584.05 mm
- Weight
- 36 kg maximum
- Operating temperature
- 10-35 °C; expanded 5-40 °C continuous and -5 to 45 °C for ≤1% of hours (no GPU, LRDIMM, non-redundant or cabled PSU)
Management
- BMC
- iDRAC8 with Lifecycle Controller: Express standard, Enterprise upgrade; 8 GB or 16 GB vFlash media (upgrade)
- Front panel
- LCD panel with three buttons on hot-plug chassis (diagnostic LEDs on the cabled chassis); iDRAC Direct port
- Tools
- IPMI 2.0; OpenManage Essentials, Mobile and Power Center; integrations for Microsoft System Center and VMware vCenter
- Security
- TPM 1.2 (configurator)
Operating systems
- Windows
- Windows Server 2008 R2, 2012, 2012 R2; 2016 Standard/Datacenter offered in the 2017 configurator
- Linux
- Red Hat Enterprise Linux (7.3 factory install offered), SUSE Linux Enterprise Server (12 SP2 offered)
- Hypervisors
- VMware vSphere ESXi, Citrix XenServer, Red Hat Enterprise Virtualization
Processors
- Intel Xeon E5-2660 v4
- Intel Xeon E5-2650 v4
- Intel Xeon E5-2650L v4
- Intel Xeon E5-2640 v4
- Intel Xeon E5-2630 v4
- Intel Xeon E5-2630L v4
- Intel Xeon E5-2623 v4
- Intel Xeon E5-2620 v4
- Intel Xeon E5-2609 v4
- Intel Xeon E5-2603 v4
- Intel Xeon E5-2660 v3
- Intel Xeon E5-2630 v3
- Intel Xeon E5-2630L v3
- Intel Xeon E5-2623 v3
- Intel Xeon E5-2620 v3
- Intel Xeon E5-2609 v3