Dell PowerEdge R750xs

Dell's 15th-generation cost-optimised two-socket 2U rack server: 3rd Gen Intel Xeon Scalable Gold/Silver (up to 32 cores, 220 W), 16 DDR4-3200 RDIMM slots (1 TB max), up to 12 x 3.5-inch or 24 x 2.5-inch (16 SAS/SATA + 8 NVMe) front drives plus 2 rear, and up to 6 low-profile PCIe slots. Aimed at virtualization, medium-density VMs or non-GPU VDI, scale-out databases and software-defined storage.

Memory

Slots: 16 DDR4 DIMM, 288-pin (8 per CPU, 8 channels x 1 DIMM)
Type: Registered ECC DDR4 RDIMM only, 1.2 V; no Optane PMem or NVDIMM
Modules: 8 GB (1R x8), 16 GB (2R x8), 32 GB (2R x8), 64 GB (2R x4), all 3200 MT/s
Max: 1 TB with two CPUs (16 x 64 GB); 512 GB with one CPU
Speed by CPU: Up to 3200 MT/s; Dell lists 2933 MT/s for the Gold 5300 series and Gold 6330, 2666 MT/s for the Silver 4300 series and Gold 6338N/6330N
Population: 1, 2, 4, 6 or 8 DIMMs per CPU (2, 4, 8, 12 or 16 per dual-CPU system); CPU 1 and CPU 2 populations should match; no more than two DIMM capacities per system

Storage

Front bays: None, 8 x 3.5" SAS/SATA (128 TB), 12 x 3.5" SAS/SATA (192 TB), 8 x 2.5" SAS/SATA or NVMe (61.44 TB), 16 x 2.5" SAS/SATA (122.88 TB) or 16 x 2.5" SAS/SATA + 8 x 2.5" NVMe (184.32 TB), hot-plug
Rear bays: Optional 2 x 2.5" SAS/SATA or NVMe (15.36 TB), with the 12 x 3.5" backplane
NVMe: Up to 8 front U.2 NVMe (8 x 2.5" NVMe or 16 + 8 backplane) plus 2 rear
Internal RAID/HBA: Front PERC: H345, H355, H745, H755, H755N, HBA355i; S150 software RAID (chipset SATA or direct-attach NVMe); internal PERC adapter option
External: PERC H840, HBA355e
Boot: BOSS-S2 (rear): hardware RAID of 2 x M.2 SSDs; internal USB; IDSDM
Optical: 8 x 3.5" chassis has an optical drive bay (blank fitted)

Graphics

Onboard: Matrox G200 with 16 MB frame buffer, up to 1920 x 1200 at 60 Hz
GPU: Not supported in any configuration

Expansion

Slot 1: System board: PCIe x16, low profile, half length (CPU 1)
Slot 2: System board: x8 connector, x4 link from the PCH (PCIe Gen3), low profile, half length
Slot 3: Riser 1A: x16, LP, half length (CPU 1); Riser 1B (SNAP I/O): x16 (CPU 1 + CPU 2); 75 W
Slot 4: Riser 1A: CPU 2 (x16 in the Technical Specifications, x8 electrical in an x16 connector in the Installation and Service Manual); Riser 1B: x8 electrical; LP, half length, 75 W
Slot 5: System board: PCIe x16, low profile, half length (CPU 2)
Slot 6: System board: PCIe x16, low profile, half length (CPU 2)
Risers: Only one cable riser (1A or 1B) at a time; configs 4 and 5 have no riser
Integrated: OCP 3.0 slot (x16), front PERC slot, BOSS-S2 module
Other: Optional serial port module (low-profile bracket); slots are not hot-swappable

Networking

LOM: 2 x 1GbE RJ45 (Broadcom BCM5720) on a Flex I/O LOM board
OCP 3.0: 1 x OCP NIC 3.0 (x16 PCIe Gen4): 1GbE x4, 10GbE x2, 25GbE x2/x4, 50GbE x2, 100GbE x2
Add-in: PCIe NICs up to 100GbE, Mellanox HDR100 VPI, 16/32 Gb FC HBAs (slot-priority tables)
SNAP I/O: Riser 1B lets both CPUs share one adapter in slot 3

Power

PSU options: 600 W Platinum, 800 W Platinum, 1100 W Titanium and 1400 W Platinum mixed mode (100-240 VAC / 240 VDC); 1100 W -48 to -60 VDC
Low line: 1100 W Titanium and 1400 W Platinum deliver 1050 W at 100-120 VAC
Redundancy: Two hot-plug 60 mm PSUs, 1+1 redundant, both at the right of the rear panel
Fans: Up to 6 hot-plug fans: Standard, High Performance Silver or High Performance Gold (no mixing); 5-fan configs use a blank in fan slot 1

Ports

Front: VGA, 1 x USB 2.0, iDRAC Direct (micro-AB USB)
Rear: 1 x USB 2.0, 1 x USB 3.0, VGA, 2 x 1GbE LOM, iDRAC9 dedicated port, optional DB-9 serial
Internal: 1 x USB 3.0 (optional)

Physical

Form factor: 2U rack
Dimensions: 86.8 mm H x 482 mm W (434 mm without ears); depth 685.78 mm ear to PSU handle, plus 22 mm ahead of the ears (35.84 mm with bezel)
Weight: 28.76 kg (12 x 3.5"), 24.80 kg (8 x 3.5"), 23.84 kg (16 + 8 x 2.5"), 21.94 kg (16 x 2.5"), 20.44 kg (8 x 2.5"), 18.54 kg (no backplane), maximum
Operating temp: 10-35 C (ASHRAE A2); A3 5-40 C and A4 5-45 C ranges are defined in the Technical Specifications
Rails: B21 ReadyRails II or B22 Stab-in/Drop-in sliding rails (optional CMA, SRB); B20 ReadyRails static rails
Acoustics: Entry config (1 CPU, 8 x 3.5"): 33 dBA idle / 34 dBA operating at 23 C; SDS config with rear drives: 52 dBA

Management

BMC: iDRAC9 with dedicated 1GbE port, Redfish RESTful API; iDRAC Direct; iDRAC Service Module; Lifecycle Controller
Wireless: Optional Quick Sync 2 (OpenManage Mobile)
Security: TPM 1.2/2.0 (Installation and Service Manual); Digital License Key
Software: OpenManage Enterprise and Power Manager; integrations for Microsoft System Center, VMware vCenter, Ansible, ServiceNow

Operating systems

Supported: Canonical Ubuntu Server LTS, Citrix Hypervisor, Microsoft Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi

Processors

Intel Xeon Gold 6338
Intel Xeon Gold 6338N
Intel Xeon Gold 6336Y
Intel Xeon Gold 6334
Intel Xeon Gold 6330
Intel Xeon Gold 6330N
Intel Xeon Gold 6326
Intel Xeon Gold 6314U
Intel Xeon Gold 6312U
Intel Xeon Gold 5320
Intel Xeon Gold 5320T
Intel Xeon Gold 5318Y
Intel Xeon Gold 5317
Intel Xeon Gold 5315Y
Intel Xeon Silver 4316
Intel Xeon Silver 4314
Intel Xeon Silver 4310
Intel Xeon Silver 4310T
Intel Xeon Silver 4309Y