Dell PowerEdge R650xs
Dell's 15th-generation cost-optimised two-socket 1U rack server: 3rd Gen Intel Xeon Scalable Gold/Silver (up to 32 cores, 220 W), 16 DDR4-3200 RDIMM slots (1 TB max), up to 10 x 2.5-inch or 4 x 3.5-inch front drives plus 2 rear, and up to 3 low-profile PCIe Gen4 slots. Aimed at virtualization, private cloud, scale-out databases and HPC.
Memory
- Slots
- 16 DDR4 DIMM, 288-pin (8 per CPU, 8 channels x 1 DIMM)
- Type
- Registered ECC DDR4 RDIMM only, 1.2 V
- Modules
- 8 GB (1R x8), 16 GB (2R x8), 32 GB (2R x8), 64 GB (2R x4), all 3200 MT/s
- Max
- 1 TB with two CPUs (16 x 64 GB); 512 GB with one CPU
- Speed by CPU
- Up to 3200 MT/s; Dell lists 2933 MT/s for the Gold 5300 series and Gold 6330, 2666 MT/s for the Silver 4300 series and Gold 6338N/6330N
- Population
- 1, 2, 4, 6 or 8 DIMMs per CPU (2, 4, 8, 12 or 16 per dual-CPU system); CPU 1 and CPU 2 populations should match; no more than two DIMM capacities per system
Storage
- Front bays
- None (diskless), 4 x 3.5" SAS/SATA HDD/SSD (64 TB), 8 x 2.5" SAS/SATA/NVMe (61.44 TB) or 10 x 2.5" SAS/SATA/NVMe (76.8 TB), hot-plug
- Rear bays
- Optional 2 x 2.5" SAS/SATA/NVMe (15.36 TB); uses the riser 2 space (riser config 0 leaves only slot 1)
- NVMe
- U.2 PCIe Gen4 and Gen3 SSDs; 8 x 2.5" NVMe (incl. NVMe RAID) and 10 x 2.5" NVMe configurations
- Internal RAID/HBA
- Front PERC: H345, H355, H745, H755, H755N, HBA355i; S150 software RAID (chipset SATA or direct-attach NVMe)
- External
- PERC H840, HBA355e; 12 Gb MD/ME-series JBODs, external tape
- Boot
- BOSS-S1 on the rear BOSS riser: hardware RAID of 2 x M.2 SATA SSD (240/480 GB); internal USB; IDSDM
- IDSDM
- Optional internal dual microSD, 16/32/64 GB (one card for redundancy)
- Optical
- Optional slim SATA DVD-ROM or DVD+/-RW in the 4 x 3.5" chassis; not supported with 8 x 2.5" drives
- Drive types
- 3.5" SAS/SATA 7.2K 2-16 TB; 2.5" SAS 10K 600 GB-2.4 TB, 15K 900 GB; SAS SSD 480 GB-7.68 TB; SATA SSD 480 GB-3.84 TB; NVMe SSD 375 GB-7.68 TB
Graphics
- Onboard
- Matrox G200 with 16 MB frame buffer, up to 1920 x 1200 at 60 Hz
- GPU
- Not supported
Expansion
- Slot 1
- Riser 1: PCIe Gen4 x16, low profile, half length (CPU 1)
- Slot 2
- Riser 2a: PCIe Gen4 x8, low profile, half length (CPU 2)
- Slot 3
- Riser 2a: x8 (CPU 2); Riser 2b SNAP I/O: x16 (CPU 1 + CPU 2); Riser 2c: x16 (CPU 2); all low profile, half length
- Configs
- 0: R1 + 2 rear drives (1 slot); 1: R1 + R2a (3 slots); 2: R1 + R2b (2); 3: R1 + R2c (2); 4: R1 only (1); 5: no risers; 6: R2c only (1)
- Integrated
- OCP 3.0 slot (x16 Gen4), front PERC slot, BOSS-S1 riser
- Other
- Optional serial port module takes a low-profile slot position; slots are not hot-swappable
Networking
- LOM
- 2 x 1GbE RJ45 (Broadcom BCM5720) on a Flex I/O LOM board
- OCP 3.0
- 1 x OCP NIC 3.0 (up to x16 PCIe Gen4): 1GbE x4, 10GbE x2/x4, 25GbE x2/x4 (Broadcom, Intel, QLogic, Mellanox, SolarFlare cards)
- Add-in
- PCIe NICs up to 100/200GbE, Mellanox HDR/HDR100 VPI, 16/32 Gb FC HBAs (slot-priority tables)
- SNAP I/O
- Riser 2b lets both CPUs share one adapter in slot 3
Power
- PSU options
- 600 W Platinum, 800 W Platinum, 1100 W Titanium and 1400 W Platinum mixed mode (100-240 VAC / 240 VDC); 1100 W -48 to -60 VDC
- Also in Tech Guide
- The Technical Guide also lists 700 W Titanium and 1800 W (200-240 VAC / 240 VDC) PSUs, which the spec sheet and Technical Specifications omit
- Low line
- 1100 W Titanium and 1400 W Platinum deliver 1050 W at 100-120 VAC
- Redundancy
- Two hot-plug 60 mm PSUs, 1+1 redundant, both at the right of the rear panel
- Fans
- Up to 7 hot-plug fans: Standard, High Performance Silver or High Performance Gold (5 fans with one CPU)
Ports
- Front
- VGA, 1 x USB 2.0, iDRAC Direct (micro-AB USB)
- Rear
- 1 x USB 2.0, 1 x USB 3.0, VGA, 2 x 1GbE LOM, iDRAC9 dedicated port, optional DB-9 serial
- Internal
- 1 x USB 3.0 (optional)
Physical
- Form factor
- 1U rack
- Dimensions
- 42.8 mm H x 482 mm W (434 mm without ears) x 734.95 mm D without bezel (748.79 mm with bezel)
- Depth by chassis
- Ear to PSU handle 712.95 mm (4 x 3.5" and 10 x 2.5") or 662.19 mm (8 x 2.5" and diskless); plus 22 mm ahead of the ears (35.84 mm with bezel)
- Weight
- 18.62 kg (4 x 3.5"), 17.12 kg (10 x 2.5" / 8 x 2.5" NVMe), 16.58 kg (8 x 2.5"), 14.84 kg (no drives), maximum
- Operating temp
- 10-35 C (ASHRAE A2); 40 C (A3) with restrictions; A4 (45 C) not supported in the 4 x 3.5", 8 x 2.5" and diskless configurations
- Rails
- A11 Stab-in/Drop-in sliding rails (optional CMA, SRB) or A8 ReadyRails static rails
- Acoustics
- Typical 2.5" config: 42 dBA idle / 44 dBA operating at 25 C (bystander position)
Management
- BMC
- iDRAC9 with dedicated 1GbE port, Redfish RESTful API; iDRAC Direct; iDRAC Service Module
- Wireless
- Optional Quick Sync 2 (OpenManage Mobile)
- Bezel
- Optional LCD bezel or security bezel
- Security
- TPM 1.2/2.0 FIPS, CC-TCG certified; TPM 2.0 China NationZ; Silicon Root of Trust, signed firmware, Secure Boot, Secure Erase, System Lockdown (iDRAC9 Enterprise or Datacenter)
- Software
- OpenManage Enterprise with Power Manager, SupportAssist and Update Manager plugins; integrations for Microsoft System Center, VMware vCenter, Ansible, ServiceNow
Operating systems
- Supported
- Canonical Ubuntu Server LTS, Citrix Hypervisor, Microsoft Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi
Processors
- Intel Xeon Gold 6338
- Intel Xeon Gold 6338N
- Intel Xeon Gold 6336Y
- Intel Xeon Gold 6334
- Intel Xeon Gold 6330
- Intel Xeon Gold 6330N
- Intel Xeon Gold 6326
- Intel Xeon Gold 6314U
- Intel Xeon Gold 6312U
- Intel Xeon Gold 5320
- Intel Xeon Gold 5320T
- Intel Xeon Gold 5318Y
- Intel Xeon Gold 5317
- Intel Xeon Gold 5315Y
- Intel Xeon Silver 4316
- Intel Xeon Silver 4314
- Intel Xeon Silver 4310
- Intel Xeon Silver 4310T
- Intel Xeon Silver 4309Y