Tech Spec Spec it right!

Dell PowerEdge MX840c

A 4-socket, double-width compute sled for the PowerEdge MX7000 modular chassis, with a very large memory footprint (up to 6 TB LRDIMM or 12.2 TB Intel Optane DC PMem) for database-driven, mission-critical and dense-virtualization workloads.

Memory

Slots
48 × DDR4 DIMM (288-pin)
Type
RDIMM, LRDIMM, NVDIMM-N (persistent memory, system board only); Intel Optane DC Persistent Memory (DCPMM) supported mixed with RDIMM/LRDIMM
Max capacity (4 CPU)
384 GB (RDIMM min) – 3 TB (RDIMM max) – 6 TB (LRDIMM max) – 12.2 TB (DCPMM max, 15.36 TB incl. DRAM)
Speed
2933 MT/s or 2666 MT/s, depending on processor and DIMM population
Restrictions
8 GB RDIMMs must not be mixed with NVDIMM-N; 64 GB and 128 GB LRDIMMs must not be mixed

Storage

Front bays
Up to 8 × 2.5" SAS/SATA/Nearline-SAS/NVMe (slots 0–7) on the 8-bay backplane, or up to 6 × 2.5" on the 6-bay backplane
NVMe placement
Dual-CPU sled: NVMe only in slots 4–7 (8-bay) or 2–5 (6-bay); Quad-CPU sled: NVMe supported in all front slots
Controllers
Entry: S140 (SW RAID); Value: HBA330, HBA330 MX, HBA330 Mini-Mezzanine; Performance: H730P, H745P (Internal), H730P MX, H745P MX (External)
Internal boot
Optional Boot Optimized Storage Solution (BOSS, 2 × M.2 SSD) or Internal Dual SD Module (IDSDM, 2 × 16/32/64 GB microSD)

Expansion

Mezzanine A/B
4 × PCIe Gen3 x16 total; Mezzanine A connects to processors 1 and 3, Mezzanine B to processors 2 and 4
Mini-mezzanine
2 × PCIe Gen3 x16, connected to processors 2 and 4

Networking

Fabric slots
MX7000 chassis: up to 2 pairs of redundant general-purpose switch/pass-through bays (Fabrics A, B) plus a redundant pair of storage-specific switch bays (Fabric C)
Speeds
Up to 25 GbE, 32 Gb Fibre Channel, 12 Gb SAS via mezzanine cards

Power

Power supplies
MX7000 chassis: up to 6 × 3000 W AC 80 PLUS Platinum, with grid redundancy
Fans
MX7000 chassis: 5 rear + 4 front-accessible hot-swap fans, fully redundant

Ports

Front
1 × USB 3.0, 1 × USB 2.0 management port (iDRAC Direct), 1 × IDSDM port (USB 3.0 + USB 2.0)
Internal
1 × USB 3.0
Video
Matrox G200eW3 integrated in iDRAC, 4 Gb DDR4 shared video memory

Physical

Dimensions
250.2 mm W × 85.5 mm H × 618 mm D (handle closed)
Weight
16.8 kg (6×2.5") – 17 kg (8×2.5") with all drives
Form factor
1U double-width compute sled; up to 4 per MX7000 chassis

Management

On sled
iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish
Chassis
OpenManage Enterprise Modular Edition (OME-Modular) via up to 2 redundant MX9002m modules; Quick Sync 2 BLE option
Software
OpenManage Enterprise, OpenManage Mobile, OpenManage Power Center; integrations for Microsoft System Center, VMware vCenter, BMC Software, Ansible
Security
TPM 1.2/2.0 (optional), cryptographically signed firmware, Silicon Root of Trust, Secure Boot, System Lockdown (iDRAC Enterprise/Datacenter), System Erase

Operating systems

Supported
Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Canonical Ubuntu LTS, Microsoft Windows Server with Hyper-V
Virtualization
VMware ESXi, Citrix XenServer

Processors

  • Intel Xeon Platinum 8180M
  • Intel Xeon Platinum 8180
  • Intel Xeon Platinum 8176M
  • Intel Xeon Platinum 8176
  • Intel Xeon Platinum 8168
  • Intel Xeon Platinum 8160M
  • Intel Xeon Platinum 8160
  • Intel Xeon Platinum 8156
  • Intel Xeon Gold 6154
  • Intel Xeon Gold 6152
  • Intel Xeon Gold 6148
  • Intel Xeon Gold 6146
  • Intel Xeon Gold 6144
  • Intel Xeon Gold 6134
  • Intel Xeon Gold 6130
  • Intel Xeon Gold 5122
  • Intel Xeon Gold 5120
  • Intel Xeon Gold 5118
  • Intel Xeon Gold 5117