Apple Mac Pro (2019)

Apple's Intel Xeon W tower workstation in the stainless-steel frame and aluminium lattice housing: one 8- to 28-core Xeon W-3200, 12 DDR4 ECC DIMM slots (up to 1.5 TB), eight PCIe 3.0 slots with two MPX bays for Apple's Radeon Pro modules, and a 1.4 kW power supply. Built for video, audio, 3D and development pros who need big memory and internal expansion; it was the last Intel Mac Apple sold.

Memory

Slots

12 DIMM slots (6 channels, 2 DIMMs per channel) on the back of the logic board, under DIMM covers

Type

288-pin full-length DDR4 ECC, 2933 MHz; R-DIMM or LR-DIMM (never mixed); 8, 16, 32, 64 or 128 GB DIMMs

Speed

2933 MHz on 12- to 28-core; the 8-core Xeon W-3223 runs memory at 2666 MHz

Max

768 GB on 8/12/16-core (6 × 128 GB or 12 × 64 GB); 1.5 TB on 24/28-core (12 × 128 GB LR-DIMM)

Factory options

32 GB (4 × 8 GB), 48 GB (6 × 8), 96 GB (6 × 16), 192 GB (6 × 32), 384 GB (6 × 64), 768 GB (6 × 128 or 12 × 64), 1.5 TB (12 × 128)

Factory DIMM type

R-DIMMs up to 192 GB; LR-DIMMs for 384 GB and above

Supported populations

4, 6, 8, 10 or 12 DIMMs; 6 or 12 for full bandwidth (1 DIMM is diagnostic only)

Bandwidth

Up to 140 GB/s (six channels of DDR4-2933)

Storage

Internal SSD

256 GB (1 module), 512 GB (1 module), 1 TB (2 × 512 GB), 2 TB (2 × 1 TB), 4 TB (2 × 2 TB) or 8 TB (2 × 4 TB)

Performance

Up to 3.4 GB/s sequential read and 3.4 GB/s sequential write (Apple test, 4 TB)

Encryption

SSD encrypted by the Apple T2 Security Chip; modules are paired to the T2

Internal SATA

2 × SATA ports plus a power connector; mounting point on the top bracket (Promise Pegasus J2i, one or two 3.5-inch 7200-rpm drives)

MPX storage

Promise Pegasus R4i 32 TB RAID MPX Module (4 × 8 TB HDD; RAID 0, 1, 5, 6, 10) in an MPX bay

Base config

256 GB SSD at launch; 512 GB from March 2022 (Wikipedia)

Graphics

Architecture

Two MPX bays; up to two MPX Modules with up to four GPUs

Radeon Pro 580X

36 CU, 8 GB GDDR5, 5.6 TFLOPS; 2 × HDMI 2.0 on card; half-height; one module only

Radeon Pro W5500X

24 CU, 8 GB GDDR6 (224 GB/s), 5.6 TFLOPS FP32; 2 × HDMI on card; half-height; one or two

Radeon Pro W5700X

40 CU, 16 GB GDDR6 (448 GB/s), 9.4 TFLOPS FP32; 4 × Thunderbolt 3 + 1 × HDMI on card; full-height; one or two

Radeon Pro W6600X

32 CU, 8 GB GDDR6 (256 GB/s), 9.8 TFLOPS FP32; 2 × HDMI on card; half-height; one module only

Radeon Pro W6800X

60 CU, 32 GB GDDR6 (512 GB/s), 16.0 TFLOPS FP32; 4 × Thunderbolt 3 + 1 × HDMI; Infinity Fabric Link; one or two

Radeon Pro W6900X

80 CU, 32 GB GDDR6 (512 GB/s), 22.2 TFLOPS FP32; 4 × Thunderbolt 3 + 1 × HDMI; Infinity Fabric Link; one or two

Radeon Pro W6800X Duo

2 × W6800X GPUs, 64 GB GDDR6, 30.2 TFLOPS FP32; 4 × Thunderbolt 3 + 1 × HDMI; one or two

Radeon Pro Vega II

64 CU, 32 GB HBM2 (1 TB/s), 14.1 TFLOPS FP32; 4 × Thunderbolt 3 + 1 × HDMI 2.0; Infinity Fabric Link; one or two

Radeon Pro Vega II Duo

2 × Vega II GPUs, 64 GB HBM2, 28.3 TFLOPS FP32; 4 × Thunderbolt 3 + 1 × HDMI 2.0; one or two

Third-party cards

Supports the same GPUs Apple supports as eGPUs (AMD); four 8-pin (150 W each) AUX connectors for cards without MPX

Displays

Up to twelve 4K, six 5K or six Pro Display XDR across four GPUs

Afterburner

Apple ProRes / ProRes RAW accelerator, PCIe x16 card (FPGA); factory-installed in slot 5; up to 6 streams of 8K or 23 streams of 4K ProRes RAW

Timeline

W5700X added April 2020, W5500X July 2020, W6800X / W6800X Duo / W6900X August 2021; W5500X replaced the 580X as base GPU in March 2022 (Wikipedia)

Expansion

Total

8 PCIe 3.0 slots: 4 double-wide, 3 single-wide, 1 half-length

Slot 1

x16, double-wide, full-length; MPX bay 1; direct CPU root port

Slot 2

x8, double-wide, full-length; MPX bay 1 (disabled when an MPX Module is in bay 1)

Slot 3

x16, double-wide, full-length; MPX bay 2; direct CPU root port

Slot 4

x16, double-wide, full-length; MPX bay 2 (disabled when an MPX Module is in bay 2)

Slot 5

x16, single-wide, full-length (Afterburner's factory slot)

Slot 6

x8, single-wide, full-length

Slot 7

x8, single-wide, full-length

Slot 8

x4, half-length, full-height; Apple I/O card installed (can be removed for another half-length card)

MPX bay

x16 gen 3 for graphics + x8 gen 3 for Thunderbolt, DisplayPort routing, up to 500 W per module

AUX power

4 × 8-pin (150 W each, 600 W total; unavailable when an MPX Module fills that bay) + 1 × 6-pin (75 W) for slots 5-7

PCIe switching

Slots 1 and 3 on dedicated CPU x16 root ports; other slots and Thunderbolt through a 96-lane PCIe switch; pool A/B set in Expansion Slot Utility

Networking

Ethernet

2 × 10Gb Ethernet (Nbase-T 1/2.5/5/10 Gb, RJ-45), two independent controllers

Wi-Fi

802.11ac, IEEE 802.11a/b/g/n compatible

Bluetooth

Bluetooth 5.0

Power

Power supply

1.4 kW, internal, replaceable

Maximum continuous power

1280 W at 108-125 V or 220-240 V; 1180 W at 100-107 V

Input

100-125 V AC at 12 A; 220-240 V AC at 6 A; 50-60 Hz, single phase

Efficiency

Meets ENERGY STAR requirements

Ports

Top

2 × Thunderbolt 3 (USB-C, 40 Gb/s; USB up to 10 Gb/s; DisplayPort), power button

Apple I/O card (rear, slot 8)

2 × Thunderbolt 3, 2 × USB-A (USB 3, 5 Gb/s), 3.5 mm headphone jack with headset support

Rear

2 × 10Gb Ethernet, AC power; HDMI / Thunderbolt 3 ports on the installed MPX Modules

Internal

1 × USB-A (5 Gb/s) for licence keys, 2 × SATA

Thunderbolt total

Up to 12 Thunderbolt 3 ports with two full-height MPX Modules; built-in ports carry video only when an MPX Module is installed

Audio

Built-in speaker; 3.5 mm headphone jack

Physical

Dimensions (tower)

52.9 cm H × 21.8 cm W × 45.0 cm D (20.8 × 8.58 × 17.7 in); 55.7 cm high with wheels

Weight

18.0 kg (39.7 lb); varies by configuration

Enclosure

Stainless-steel space frame with top handles, aluminium lattice housing that lifts off for 360° access; feet standard, wheels optional (customer-installable kits)

Cooling

Front-to-back airflow; three fans

Operating temperature

10-35 °C

Storage temperature

-40 to 47 °C

Relative humidity

5-95 % non-condensing

Altitude

Tested up to 5000 m

Acoustics

11 dB sound pressure (2.7 B sound power) at idle and wireless web; 8-core, 580X, 32 GB tested

Model number

A1991 (Wikipedia)

Management

Security chip

Apple T2: Secure Enclave, secure boot, hardware SSD encryption, SMC and audio controller

Lights Out Management

Supported through MDM (macOS 11 or later, Ethernet on the same subnet)

Model identifier

MacPro7,1

Status light

Top and rear; amber flashes signal memory errors (e.g. mixed R-DIMM/LR-DIMM) or PCIe card errors

Operating systems

Shipped with

macOS Catalina (10.15)

Newest supported

macOS Tahoe 26

Windows

Boot Camp; Apple notes GPU and RAID limits under Windows

Processors

• Intel Xeon W-3223
• Intel Xeon W-3235
• Intel Xeon W-3245
• Intel Xeon W-3265M
• Intel Xeon W-3275M